Services
Printed Circuit Board (PCB)
A solid backbone is crucial for the production of any significant and durable device. In our industry, the fundamental structure of each electronic assembly is its Bare Circuit Board.
State of the art equipment and rigorous processes are used in the manufacturing process. We are confident to say that each trace and layer of your boards will be meticulously fabricated to meet your requirements and exceed your expectations.
Capabilities
|
Line Width/Space |
35/35 um |
|
Impedance |
5% |
|
Maximum Layer Count |
68L |
|
Board Thickness |
0.1 – 10 mm |
|
Hole to Hole Accuracy |
+/-50 um |
|
Max Aspect Ratio |
20:1 |
|
Mechanical Blind Hole |
150 um |
|
Through Hole Size Tolerance PTH |
+/-50 um |
|
Through Hole Size Tolerance NPTH |
+/-25 um |
|
Min Laser Blind Via |
75 um |
|
Laser Via Aspect Ratio |
0.8:1 |
|
Max Lamination Times |
6+N+6 |
|
Max Outer Copper Thickness |
6oz |
|
Max Inner Copper Thickness |
4oz |
|
Surface Finish |
HASL-LF, ENIG,ENEPIG, OSP, Immersion Silver, Immersion Tin, Hard Gold |
|
Flex Boards |
Flex and Flex-Rigid |
|
Production Class |
IPC Class 2, 3 , MIL-SPEC |
Materials
Technology Showcase
Back Drill Technology
Hybrid material Lamination
High Layer Count
Any-Layer PCB
Product Showcase
Flex PCB
Flex-Rigid PCB
34 Layer ATE PCB
5G Communication Board
High-frequency Mix-lamination Board
Optical PCB with Gold Fingers
Multilayer PCB
HDI PCB with Backdrill
